SMD2018貼片自恢復(fù)保險絲

Performance Specification

Model	V _max (V dc)	I_max (A)	I _hold @25°C (A)	I _trip @25°C (A)	P_d Typ. (W)	Maximum Time To Trip		Resistance
Model	V _max (V dc)	I_max (A)	I _hold @25°C (A)	I _trip @25°C (A)	P_d Typ. (W)	Current (A)	Time (Sec)	R i _min (W)	R1max (W)
SMD2018-030SF	60	10	0.30	0.60	0.9	1.5	3.00	0.500	2.300
SMD2018-050SF	60	10	0.55	1.20	1.0	2.5	3.00	0.200	1.000
SMD2018-075SF	60	10	0.75	1.50	1.1	8.0	0.30	0.110	0.630
SMD2018-100SF	15	35	1.10	2.20	1.1	8.0	0.40	0.060	0.360
SMD2018-100SF33V	33	35	1.10	2.20	1.1	8.0	0.40	0.060	0.360
SMD2018-150SF	15	35	1.50	3.00	1.1	8.0	0.80	0.050	0.170
SMD2018-200SF	10	35	2.00	4.00	1.1	8.0	2.40	0.030	0.100

V max = Maximum operating voltage device can withstand without damage at rated current (Imax).

I max = Maximum fault current device can withstand without damage at rated voltage (V max).

I hold = Hold Current. Maximum current device will not trip in 25°C still air.

I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.

Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C.

R1max = Maximum device resistance is measured one hour post reflow.

CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.

Environmental Specifications

Test	Conditions	Resistance change
Passive aging	+85°C, 1000 hrs.	±5% typical
Humidity aging	+85°C, 85% R.H. , 168 hours	±5% typical
Thermal shock	+85°C to -40°C, 20 times	±33% typical
Resistance to solvent	MIL-STD-202,Method 215	No change
Vibration	MIL-STD-202,Method 201	No change
Ambient operating conditions : - 40 °C to +85 °C
Maximum surface temperature of the device in the tripped state is 125 °C

Thermal Derading Chart

Recommended Hold Current(A) at Ambient Temperature(°C)

Model	Ambient Operation Temperature
Model	-40°C	-20°C	0°C	25°C	40°C	50°C	60°C	70°C	85°C
SMD2018-030SF	0.48	0.42	0.35	0.30	0.24	0.21	0.17	0.15	0.10
SMD2018-050SF	0.87	0.77	0.67	0.55	0.46	0.41	0.36	0.31	0.23
SMD2018-075SF	1.19	1.05	0.91	0.75	0.61	0.54	0.47	0.41	0.32
SMD2018-100SF	1.71	1.52	1.32	1.10	0.94	0.84	0.74	0.64	0.50
SMD2018-150SF	2.38	2.10	1.82	1.50	1.27	1.13	0.99	0.85	0.64
SMD2018-200SF	2.95	2.65	2.35	2.00	1.74	1.59	1.44	1.29	1.06

Thermal Derating Curve

Average Time-Current Curve

Soldering Parameters

Profile Feature	Pb-Free Assembly
Average Ramp-Up Rate(Ts max to T p)	3℃/second mac.
Preheat -Temperature Min(Ts min) -Temperature Max(Ts max) -Time(Ts min to Ts max)	150℃ 200℃ 60~180 seconds
Time maintained above: -Temperature(TL) -Time(tL)	217℃ 60~150 seconds
Peak Temperature(Tp)	260℃
Ramp-Down Rate	6℃/second max.
Time 25℃ to Peak Temperature	8 minutes max
Storage Condition	0℃~30℃,30%~60%RH

Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free

Recommended maximum paste thickness is 0.25mm

Devices can be cleaned using standard industry methods and solvents.

Note 1:All temperature refer to topside of the package, measured on the package body surface.

Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

Physical Dimensions(mm.)

Model	A		B		C		D	E
Model	Min.	Max.	Min.	Max.	Min.	Max.	Min.	Min.
SMD2018-030SF	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25
SMD2018-050SF	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25
SMD2018-075SF	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25
SMD2018-100SF	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25
SMD2018-100SF33V	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25
SMD2018-150SF	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25
SMD2018-200SF	4.72	5.44	4.22	4.93	0.50	1.20	0.30	0.25

Termination Pad Characteristics

Terminal pad materials：Tin-plated Nickel-Copper

Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.

Recommended Pad Layout (mm.)

Tape And Reel Specifications (mm)

Governing Specifications		EIA 481-1
W		12.0 ± 0.2
P0		4.0 ± 0.10
P1		8.0 ± 0.10
P2		2.0 ± 0.05
A0		4.40 ± 0.10
B0		5.50 ± 0.10
B1max.		8.20
D0		1.50 + 0.1, -0
F		5.5 ± 0.05
E1		1.75 ± 0.10
E2min.		10.25
T		0.6
T1max.		0.1
K0		1.36 ± 0.1
Leader min.		390
Trailer min.		160
Reel Dimensions
A max.		178
N min.		50
W1		12.4 ± 0.5
W2		18.4 ± 0.5

Storage And Handling
? Storage conditions：0℃~30℃, 30%~60% R.H.
? Devices may not meet specified performance
if storage conditions are exceeded.

Part Number System

SMD 2018 - 口口口 S F 口口V
special voltage Rating(Optional)

Lead-Free

Tin-plated Nickel-Copper

Holding Current Rating

Device Dimensions: Length/width(Unit:1/100 inch) Size 5045 mm / 2018 inch

Surface Mount Device

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